Ceramic Hybrid Ic Packaging

Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

Ceramic hybrid ic packaging.

A multi chip module mcm is generically an electronic assembly such as a package with a number of conductor terminals or pins where multiple integrated circuits ics or chips semiconductor dies and or other discrete components are integrated usually onto a unifying substrate so that in use it can be treated as if it were a larger ic. 0 010 pad spacing matches ic sensor. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. 0 100 double row edge pinout.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Circular and slotted holes allow mechanical positioning. Mechanical integrity provided by using shoulder pins. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.

At the same time the vacuum tight housings and substrates must. Transistors diodes or monolithic ics and passive components e g. A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g. In support of our defense customers we are an itar registered facility accredited trusted supplier and dla mil prf 38535 certified assembly mfg.

Twenty mil thick ultra. Co 2 lasered ceramic with matching window frame. Plated holes enabling multiple conductor levels. Resistors inductors transformers and capacitors bonded to a substrate or printed circuit board pcb.

Other terms such as hybrid or hybrid.