Ceramic Dip Package

Spst x 4 two complementary pairs per package.

Ceramic dip package.

14 lead cerdip q 14 pdf. Like dip but with staggered zig zag pins. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

Ceramic substrates for probe cards. Medical and healthcare. Another example of a ceramic. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities.

Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. Both passive or active devices may be found using ceramic packages. Standard packages and lids for device evaluation. Medical and healthcare.

7 62 mm or 0 6 inch 15 24 mm. Material properties process flow. And having a row spacing associated with body width varies depending on lead counts with 0 3 in. Eprom ics in 0 6 wide ceramic dip 40 dip 32 dip 28 dip 24 packages also known as cdip ceramic dip 8 contact dip switch with 0 3 wide 16 pin dip 16n footprint in microelectronics a dual in line package dip or dil 1 or dual in line pin package dipp 2 is an electronic component package with a rectangular housing and two.

Package outline material information. Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. Ceramic packages for large scale integration lsi devices. Non standard dip with smaller 0 07 in 1 78 mm pin spacing.

Packages come in many forms including dip dual inline sip single inline and pga pin grid array pin insertion types and surface mount types including j lead flat lead gull wing leadless bga ball grid array lga land grid array csp chip size package and other types.