Ceramic Chip Capacitor Array

Tdk s unique design offers low cross talk to truly give separate individual capacitors in a single package.

Ceramic chip capacitor array.

This is achieved by. Tdk ckc series capacitor arrays offer multiple multilayer ceramic chip capacitors mlccs in a single package. This permits a broad range of capacitance values. This is achieved by alternatively placing one device rather than two or four discrete devices.

Capacitors capacitor networks arrays are in stock at digikey. Lead free rohs compliant. Kemet s ceramic chip capacitor array in x7r dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Ci series 10 100v chip array capacitor 10pf 0 10uf.

Kemet s ceramic chip capacitor array in c0g dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Ci multilayer ceramic chip capacitor. Feedthrough ceramic capacitor used for bypass purposes in high frequency circuits. Array technology promotes reduced placement costs and increased throughput.

Array technology promotes reduced placement costs and increased throughput. Overview tecdia chip capacitors are normally constructed as square chips for single values and binary capacitor arrays and in rectangular shapes for capacitor row arrays and custom designs. Kemet s ceramic chip capacitor array in x7r dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology allows design.

Some of the most common are. Multilayer ceramic chip capacitors array type. The kemet ceramic chip capacitor array is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Ceramic capacitors come in various shapes and styles.

Capacitors ship same day. This is achieved by alternatively placing one device. Lead free status rohs status. Ceramic disc capacitor single layer disc resin coated with through hole leads.

Tecdia uses variations in chip thickness by lapping as well as electrode ceramic size and dielectric constant to construct capacitors. Arrays are offered in 2 in 1 and 4 in 1 package styles.